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1.发明申请STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME 审中-公开结构体和电子元件和印刷线路板包括它们公开(公告)号：US20130192873A1
公开(公告)日：2013-08-01
申请号：US13678107
申请日：2012-11-15
Applicant: TDK CORPORATION
Inventor： Makoto ORIKASA , Hideyuki SEIKE , Noboru ITO , Kenichi YOSHIDA , Yuhei HORIKAWA
IPC: H01B1/00
Abstract: This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.
Abstract translation: 该结构体包括以Cu为主要成分的导体，形成在导体上的中间层和形成在中间层上的保护层，中间层至少包括Cu，Sn，Ni和P，保护层 至少包括Ni和P.
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