公开(公告)号：US20220293332A1

公开(公告)日：2022-09-15

申请号：US17687940

申请日：2022-03-07

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Kosuke ITO ,  Shinichi KONDO ,  Shingo HATTORI ,  Hidenobu UMEDA

IPC: H01F27/29 ,  H01F27/32 ,  H01F41/04

Abstract: A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.

公开(公告)号：US20220293339A1

公开(公告)日：2022-09-15

申请号：US17686599

申请日：2022-03-04

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Kosuke ITO ,  Shingo HATTORI

IPC: H01F41/04 ,  H01F41/12 ,  G03F7/00

Abstract: A method for manufacturing a multilayer coil component 1 includes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.

公开(公告)号：US20220181073A1

公开(公告)日：2022-06-09

申请号：US17523202

申请日：2021-11-10

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Kazuhiro EBINA ,  Kouichi KAKUDA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Yuya ISHIMA ,  Masaki TAKAHASHI ,  Takahiro SATO ,  Keito YASUDA ,  Shingo HATTORI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04

Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.

公开(公告)号：US20240242883A1

公开(公告)日：2024-07-18

申请号：US18410188

申请日：2024-01-11

Applicant: TDK Corporation

Inventor： Yuya ISHIMA ,  Kenji KOMORITA ,  Shingo HATTORI ,  Yoji TOZAWA ,  Masaki TAKAHASHI ,  Hidenobu UMEDA ,  Yusuke NAGAI ,  Akihiko OIDE

IPC: H01F41/076 ,  H01F41/12

CPC classification number: H01F41/076 ,  H01F41/122

Abstract: A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.

公开(公告)号：US20210074474A1

公开(公告)日：2021-03-11

申请号：US17010427

申请日：2020-09-02

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Kosuke ITO ,  Shingo HATTORI

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29 ,  H05K3/46 ,  H05K1/16

Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

公开(公告)号：US20210065975A1

公开(公告)日：2021-03-04

申请号：US17004334

申请日：2020-08-27

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Kosuke ITO ,  Shingo HATTORI ,  Takashi SUZUKI ,  Hidenobu UMEDA

IPC: H01F41/04 ,  H01F27/28 ,  H01F41/12

Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.

公开(公告)号：US20210012947A1

公开(公告)日：2021-01-14

申请号：US16922533

申请日：2020-07-07

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Kosuke ITO ,  Shingo HATTORI ,  Kazuya TOBITA ,  Noriaki HAMACHI ,  Atsushi MORIYA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.