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公开(公告)号：US20220293339A1
公开(公告)日：2022-09-15
申请号：US17686599
申请日：2022-03-04
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI
Abstract: A method for manufacturing a multilayer coil component 1 includes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.
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公开(公告)号：US20240079177A1
公开(公告)日：2024-03-07
申请号：US18359419
申请日：2023-07-26
Applicant: TDK CORPORATION
Inventor： Yusuke NAGAI , Kazuhiro EBINA , Takahiro SATO , Masaki TAKAHASHI , Takashi ENDO , Yuya ISHIMA , Kosuke ITO , Takuya MIYASHITA
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066
Abstract: A multilayer coil component includes an element body, a plurality of coil conductors, a first resistive layer, and a second resistive layer. The plurality of coil conductors are disposed in the element body and electrically connected to each other. The plurality of coil conductors include a first coil conductor and a second coil conductor adjacent to each other. The first resistive layer and the second resistive layer oppose each other between the first coil conductor and the second coil conductor. The first resistive layer is in contact with the first coil conductor.
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公开(公告)号：US20230230742A1
公开(公告)日：2023-07-20
申请号：US18085983
申请日：2022-12-21
Applicant: TDK CORPORATION
Inventor： Yusuke NAGAI , Kazuhiro EBINA , Kunihiko KAWASAKI , Shinichi KONDO , Yuya ISHIMA , Shinichi SATO , Seiichi NAKAGAWA , Kosuke ITO , Keito YASUDA , Youhei IIDA
CPC classification number: H01F17/0013 , H01F27/292 , H01F27/022 , H01F1/36
Abstract: A multilayer coil component includes an element body including an end surface, a coil disposed in the element body, and an external electrode disposed on an end portion of the element body and connected to the coil. The external electrode includes a conductive resin layer. The conductive resin layer includes resin and a plurality of metal particles and is in contact with the end surface. The conductive resin layer includes a metal particle group. The metal particle group consists a plurality of first metal particles included in the plurality of metal particles, and the plurality of first metal particles is adjacent to the end surface and separated from the end surface.
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公开(公告)号：US20230215616A1
公开(公告)日：2023-07-06
申请号：US18090240
申请日：2022-12-28
Applicant: TDK CORPORATION
Inventor： Yusuke NAGAI , Kazuhiro EBINA , Kunihiko KAWASAKI , Shinichi KONDO , Yuya ISHIMA , Shinichi SATO , Kosuke ITO
CPC classification number: H01F27/292 , H01F17/0013 , H01F1/24
Abstract: A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.
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Patent Agency Ranking
公开(公告)号：US20210074474A1
公开(公告)日：2021-03-11
申请号：US17010427
申请日：2020-09-02
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI
Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.
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公开(公告)号：US20210065975A1
公开(公告)日：2021-03-04
申请号：US17004334
申请日：2020-08-27
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI , Takashi SUZUKI , Hidenobu UMEDA
Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.
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公开(公告)号：US20210012947A1
公开(公告)日：2021-01-14
申请号：US16922533
申请日：2020-07-07
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI , Kazuya TOBITA , Noriaki HAMACHI , Atsushi MORIYA
Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.
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公开(公告)号：US20230072794A1
公开(公告)日：2023-03-09
申请号：US17939027
申请日：2022-09-07
Applicant: TDK CORPORATION
Inventor： Yusuke NAGAI , Kazuhiro EBINA , Takahiro SATO , Kunihiko KAWASAKI , Shinichi SATO , Shinichi KONDO , Kouichi KAKUDA , Yuya ISHIMA , Kosuke ITO
Abstract: A multilayer coil component includes: an element body formed by stacking a magnetic body layer containing a plurality of metal magnetic particles of a soft magnetic material; a first coil disposed in the element body and configured to include a plurality of first coil conductors; a second coil disposed in the element body and configured to include a plurality of second coil conductors; a first external electrode to which one end portion of each of the first coil and the second coil is connected; and a second external electrode to which the other end portion of each of the first coil and the second coil is connected.
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公开(公告)号：US20220293332A1
公开(公告)日：2022-09-15
申请号：US17687940
申请日：2022-03-07
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Kosuke ITO , Shinichi KONDO , Shingo HATTORI , Hidenobu UMEDA
Abstract: A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.
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