公开(公告)号：US20210358683A1

公开(公告)日：2021-11-18

申请号：US17320402

申请日：2021-05-14

Applicant: TDK CORPORATION

Inventor： Kyosuke INUI ,  Makoto MORITA ,  Takashi KUDO ,  Toshiyuki ANBO ,  Kyohei TONOYAMA ,  Fuyuki MIURA ,  Masanori SUGAI ,  Eietsu ABE ,  Toru TONOGAI ,  Yuichi OYANAGI

IPC: H01F27/29 ,  H01F27/28

Abstract: An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

公开(公告)号：US20250157724A1

公开(公告)日：2025-05-15

申请号：US19022371

申请日：2025-01-15

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Takashi SUZUKI ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Keito YASUDA ,  Ryuichi WADA ,  Makoto MORITA ,  Takashi KUDO ,  Kyohei TONOYAMA

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04

Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

公开(公告)号：US20230123939A1

公开(公告)日：2023-04-20

申请号：US17964457

申请日：2022-10-12

Applicant: TDK CORPORATION

Inventor： Shota OTSUKA ,  Takashi KUDO ,  Kyohei TONOYAMA ,  Taiji MATSUI

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/24 ,  H01F27/34 ,  H01F27/02

Abstract: In a coil component includes an insulating layer interposed between an external terminal and an element body and formed in an entire region excluding a connection region in a formation region in which the external terminal is formed, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown does not occur or hardly occurs because of the insulating layer.

公开(公告)号：US20190027287A1

公开(公告)日：2019-01-24

申请号：US16033521

申请日：2018-07-12

Applicant: TDK CORPORATION

Inventor： Takashi KUDO ,  Makoto MORITA ,  Fuyuki MIURA

IPC: H01F5/04 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30

Abstract: A coil device includes a coil portion, an element body, and a terminal electrode. The coil portion is formed by a wire wound in a coil shape. The element body contains the coil portion where a part of an outer circumference of a lead-out part of the coil portion is exposed as an exposed portion from a bottom surface of the element body and where the rest of the outer circumference of the lead-out part of the coil portion is embedded as an embedded portion in the element body. The terminal electrode is formed on the bottom surface of the element body and connected with the exposed portion. An embedded length of the outer circumference of the lead-out part in the embedded portion is larger than a substantially half of a full length of the outer circumference of the lead-out part.

公开(公告)号：US20230119388A1

公开(公告)日：2023-04-20

申请号：US17964129

申请日：2022-10-12

Applicant: TDK CORPORATION

Inventor： Shota OTSUKA ,  Takashi KUDO ,  Kyohei TONOYAMA ,  Taiji MATSUI ,  Ken SATOH ,  Miyuki ASAI

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/29 ,  H01F27/02 ,  H01F27/34

Abstract: In the coil component, the external terminal and the metal magnetic powder-containing resin constituting the element body are not in direct contact with each other, and thus high ESD resistance is obtained. That is, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown is less likely to occur, and an improvement in breakdown voltage with respect to the transient voltage can be realized.

公开(公告)号：US20220328242A1

公开(公告)日：2022-10-13

申请号：US17701920

申请日：2022-03-23

Applicant: TDK CORPORATION

Inventor： Takashi ISHII ,  Takashi KUDO ,  Hirofumi SASAKI

IPC: H01F27/30 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24

Abstract: A coil device includes: an inner core including a winding core portion wound by a wire, an upper flange portion with a first end portion on one side of the winding core portion, and a lower flange portion with a second end portion on the other side of the winding core portion; an outer core having an insertion hole and disposed outside the inner core, the inner core being inserted to the insertion hole; and a pair of terminal portions on the outer core, lead portions of the wire connect to the terminal portions. The number of wire turns along a radial direction of the winding core portion is larger on one side of the winding core portion than on the other side, and a wire winding end position is at the first end portion on the one side of the winding core portion with a wire winding start position.

公开(公告)号：US20220108836A1

公开(公告)日：2022-04-07

申请号：US17490893

申请日：2021-09-30

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Takashi SUZUKI ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Keito YASUDA ,  Ryuichi WADA ,  Makoto MORITA ,  Takashi KUDO ,  Kyohei TONOYAMA

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04

Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

公开(公告)号：US20190006089A1

公开(公告)日：2019-01-03

申请号：US16014101

申请日：2018-06-21

Applicant: TDK CORPORATION

Inventor： Takashi KUDO

IPC: H01F27/29 ,  H01F17/00 ,  H01F27/28 ,  H01F5/00

Abstract: An electronic device includes a component body and a terminal electrode formed on a mounting surface of the component body. The chamfered part is formed at an intersection between the mounting surface and a side surface of the component body. An edge of the terminal electrode becomes thinner toward the chamfered part.

公开(公告)号：US20180226184A1

公开(公告)日：2018-08-09

申请号：US15886485

申请日：2018-02-01

Applicant: TDK CORPORATION

Inventor： Takashi KUDO ,  Makoto MORITA ,  Fuyuki MIURA ,  Naoki SATOU ,  Kyohei TONOYAMA ,  Yasunori CHIBA ,  Masanori SUGAI ,  Junichi AOYADO

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04 ,  H01F17/00

CPC classification number: H01F27/28 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/24 ,  H01F41/04 ,  H01F2017/048

Abstract: A coil device includes a conductor and a terminal electrode. The conductor is embedded in a core body and wound in a coil shape. The terminal electrode is formed on an end surface of the core body and connected with a lead end of the conductor. The coil device further includes a dummy conductor embedded in the core body separately from the conductor. An end part of the dummy conductor exposed from the end surface of the core body separately from the lead end is connected with the terminal electrode.