公开(公告)号：US20240120142A1

公开(公告)日：2024-04-11

申请号：US18480760

申请日：2023-10-04

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Akihiko OIDE ,  Daiki KATO ,  Makoto YOSHINO ,  Takashi ENDO ,  Takuya KODAMA ,  Akira AKASAKA ,  Ken ITOH

IPC: H01F27/02 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F27/29

Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.