公开(公告)号：US20250105498A1

公开(公告)日：2025-03-27

申请号：US18887078

申请日：2024-09-17

Applicant: TDK Corporation

Inventor： Shoma KAJIKIYA ,  Tomoyuki GOI

IPC: H01Q1/38 ,  H01Q1/22

Abstract: An antenna device is an antenna device including a mesh-shaped conductor pattern having a plurality of mesh portions, in which the conductor pattern includes a plurality of first electroconductive lines extending in a first direction and a plurality of second electroconductive lines extending in a second direction intersecting the first direction, an opening and a slit extending from the opening to an edge of the conductor pattern are formed in the conductor pattern as a region where the first electroconductive lines and the second electroconductive lines are not formed, a width of the slit is smaller than a width of the opening, and at least a part of the mesh portions arranged at an edge of the slit is opened to the slit.

公开(公告)号：US20230065767A1

公开(公告)日：2023-03-02

申请号：US17900179

申请日：2022-08-31

Applicant: TDK Corporation

Inventor： Yasuyuki HARA ,  Tomoyuki GOI

IPC: H01Q9/04 ,  H01Q5/314 ,  H01Q1/22

Abstract: Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.

公开(公告)号：US20250063818A1

公开(公告)日：2025-02-20

申请号：US18801851

申请日：2024-08-13

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Daisuke SONODA ,  Toshiaki KASAI ,  Tomoyuki GOI ,  Yasumasa HARIHARA

IPC: H01L27/12

Abstract: A wiring body includes a first resin layer having a first main surface and a second main surface and having a through hole passing from the first main surface to the second main surface, an electroconductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the electroconductive layer from the first main surface side.

公开(公告)号：US20220085508A1

公开(公告)日：2022-03-17

申请号：US17472192

申请日：2021-09-10

Applicant: TDK Corporation

Inventor： Hisashi KOBUKE ,  Yasumasa HARIHARA ,  Kenichi TEZUKA ,  Tomoyuki GOI

IPC: H01Q9/04

Abstract: An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.

公开(公告)号：US20250151197A1

公开(公告)日：2025-05-08

申请号：US18713870

申请日：2022-11-29

Applicant: TDK Corporation

Inventor： Yuusuke IKEMURA ,  Yasumasa HARIHARA ,  Tomoyuki GOI ,  Hiroshi SHINGAI

IPC: H05K1/11

Abstract: A wiring body includes an electrode and a terminal, in which the electrode and the terminal each have a conductor pattern including a plurality of openings, and the terminal has, on the conductor pattern, a conductor layer extending in a planar shape so as to cover at least a part of the conductor pattern.

公开(公告)号：US20250141095A1

公开(公告)日：2025-05-01

申请号：US18931920

申请日：2024-10-30

Applicant: TDK Corporation

Inventor： Tomoyuki GOI ,  Matsumi WADA ,  Kenichi TEZUKA ,  Hiroshi SHINGAI

IPC: H01Q1/27 ,  G02B27/01 ,  G02C11/00 ,  H01Q1/38

Abstract: A wiring body includes a base board, a ground pattern provided on the base board, and a conductor portion including a first conductor pattern and a second conductor pattern containing metal. The ground pattern is a conductor pattern extending so as to form a planar surface. The second conductor pattern is a mesh-like conductor pattern connected to the first conductor pattern. The conductor portion is able to be arranged in a bent state.

公开(公告)号：US20230307810A1

公开(公告)日：2023-09-28

申请号：US18189417

申请日：2023-03-24

Applicant: TDK CORPORATION

Inventor： Yuta ASHIDA ,  Masahiro TATEMATSU ,  Shuhei SAWAGUCHI ,  Kenichi TEZUKA ,  Aozora KAWASAKI ,  Tetsuzo GOTO ,  Tomoyuki GOI

IPC: H01P1/20

CPC classification number: H01P1/20 ,  H01P7/06

Abstract: A filter includes a first port, a second port, a path, a circuit part, and at least one cavity resonator. The path connects the first port and the second port. The circuit part is provided in the path. Each of the at least one cavity resonator is coupled with the path from an outside of the path in a circuit configuration. The first cavity resonator is coupled with the path between the first port and the circuit part. The second cavity resonator is coupled with the path between the second port and the circuit part.