摘要:
The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.
摘要:
A clean box is composed of a box body having an opening in one surface thereof and a lid member for closing the opening. An annular groove is formed so as to surround the opening on one of the box body or the lid member for defining a suction space sealed between the lid member and the box body under the condition that the lid member is mounted on the box body. Furthermore, intake/exhaust ports are provided for vacuum exhaust/release from the outside.
摘要:
Disclosed is a sealing system for intake and exhaust ports used when performing purging on the interior of a container accommodating objects, such as an FOUP, wherein the sealing of the intake and exhaust lines is effected in a satisfactory manner with respect to the external environment. The sealing member has a ring-shaped main body portion, an inner peripheral lip protruding from the ring inner peripheral portion of the main body portion, and an outer peripheral lip protruding from the ring outer peripheral portion of the main body portion, wherein the space formed by the inner peripheral lip, the outer peripheral lip, etc. can be evacuated.
摘要:
The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.
摘要:
A wafer processing apparatus on which a pod having an opening is detachably mounted is provided with a door unit and a mapping unit provided with a transmitting type sensor having an emitter and a detector forming a slot therebetween. The emitter and the detector are moved toward the opening in the pod and are plunged into the interior of the pod after a door is opened by the door unit, and the slot between the emitter and the detector crosses an end portion of a wafer to thereby detect the presence or absence of the wafer. Thereby, a mechanism portion liable to produce dust which may adhere to the wafer and cause the contamination thereof can be disposed separately from the pod.
摘要:
The invention is intended to prevent, in a local clean system, attachment of particles to a wafer, which would occur when the wafer is taken out from a clean box. To achieve the object, an operating method of a local clean system including a processing apparatus, a load port annexed thereto and a clean box set to the load port, comprises the steps of, setting the clean box on the load port, opening a communication path between the load port and the processing apparatus, opening, after said communication path is opened fully, the clean box and bringing a cassette in which a wafer is accommodated inside the clean box into an interior of the load port, and taking the wafer out of the cassette and transferring the wafer into the interior of the processing apparatus.
摘要:
A wafer processing apparatus on which a pod having an opening is detachably mounted is provided with a door unit and a mapping unit provided with a transmitting type sensor having an emitter and a detector forming a slot therebetween. The emitter and the detector are moved toward the opening in the pod and are plunged into the interior of the pod after a door is opened by the door unit, and the slot between the emitter and the detector crosses an end portion of a wafer to thereby detect the presence or absence of the wafer. Thereby, a mechanism portion liable to produce dust which may adhere to the wafer and cause the contamination thereof can be disposed separately from the pod.