公开(公告)号：US20010011668A1

公开(公告)日：2001-08-09

申请号：US09774624

申请日：2001-02-01

Applicant: TDK CORPORATION 13-1, Nihonbashi 1-chome, Chuo-ku, Tokyo, Japan

Inventor： Masashi Gotoh ,  Jitsuo Kanazawa ,  Koichiro Okazaki ,  Toru Mizuno ,  Yoshihiro Onozeki

IPC: B23K001/06 ,  B23K005/20 ,  B23K020/10

CPC classification number: H01L21/67144 ,  H01L2224/16 ,  H01L2224/75302 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 nullm.

公开(公告)号：US20040264872A1

公开(公告)日：2004-12-30

申请号：US10875203

申请日：2004-06-25

Applicant: TDK CORPORATION

Inventor： Yoshihiro Onozeki ,  Masaaki Kaneko ,  Hitoshi Nakayama ,  Masanori Gotoh ,  Shinji Atsuzawa

IPC: G02B006/26

CPC classification number: G02B6/30 ,  G02B6/385 ,  G02B6/3885 ,  G02B6/4221

Abstract: An object of the present invention is to provide an element connecting apparatus with which the position of a core of each element in an optical transmission module in a short time with high accuracy. To attain the object, in a core position detection method according to the present invention, upon detecting a core of a PLC chip, parallel light is made incident on the output side end face of the PLC chip, so that the core position is detected based on an image of the input side end face obtained with the parallel light. In addition, the core position is detected by an image of the output side end face that is obtained while parallel light is made incident on the input side end face.

Abstract translation: 本发明的一个目的是提供一种元件连接装置，其中以高精度在短时间内将光学传输模块中的每个元件的芯的位置与该元件连接装置。 为了达到此目的，在本发明的核心位置检测方法中，在检测到PLC芯片的芯部时，使并行光入射到PLC芯片的输出侧端面，从而基于检测到芯位置 在用平行光获得的输入侧端面的图像上。 此外，通过在平行光入射到输入侧端面时获得的输出侧端面的图像来检测芯位置。