MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240331913A1

    公开(公告)日:2024-10-03

    申请号:US18602425

    申请日:2024-03-12

    Inventor: Yuki MATSUMOTO

    CPC classification number: H01F17/0013 H01F27/288 H01F27/29 H01F2017/0026

    Abstract: An electronic component includes a first inductor, a second inductor, and a shield structure. Each of the first inductor and the second inductor includes a plurality of inductor conductor layers. The plurality of inductor conductor layers include a first conductor layer closest to a first surface of a stack and a second conductor layer closest to a second surface of the stack. The shield structure is arranged between the first inductor and the second inductor when viewed in a stacking direction, and is arranged between the second conductor layer of each of the first inductor and the second inductor and the first surface of the stack.

    MULTILAYERED FILTER DEVICE
    2.
    发明公开

    公开(公告)号:US20240322778A1

    公开(公告)日:2024-09-26

    申请号:US18602398

    申请日:2024-03-12

    Inventor: Yuki MATSUMOTO

    CPC classification number: H03H7/0115 H03H7/0161 H03H2001/0085

    Abstract: Each of a plurality of resonators of a filter device is wound around an axis orthogonal to a stacking direction of a plurality of dielectric layers of a stack and is arranged in a manner that an opening of each of the resonators faces one or more openings of one or two other resonators. The plurality of resonators include a first resonator and a second resonator adjacent to each other in a circuit configuration. Each of the first resonator and the second resonator includes a first portion and a second portion arranged with a certain distance in a direction parallel to the axis. The second portion of the first resonator and the first portion of the second resonator are adjacent to each other.

    MULTILAYERED FILTER DEVICE
    3.
    发明公开

    公开(公告)号:US20240204742A1

    公开(公告)日:2024-06-20

    申请号:US18538245

    申请日:2023-12-13

    CPC classification number: H03H7/0115 H03H7/1775 H03H2001/0085

    Abstract: A filter device includes a plurality of resonators and a stack. The plurality of resonators include a first parallel resonator and a first serial resonator. The first parallel resonator includes a conductor structure wound around an axis extending in a direction orthogonal to a stacking direction. The first serial resonator includes a conductor layer wound around an axis extending in a direction parallel to the stacking direction. The conductor layer includes three portions each located between a corresponding one of three side surfaces and at least part of the conductor structure when seen in the stacking direction.

    BAND-PASS FILTER
    4.
    发明公开
    BAND-PASS FILTER 审中-公开

    公开(公告)号:US20230318560A1

    公开(公告)日:2023-10-05

    申请号:US18179737

    申请日:2023-03-07

    Inventor: Yuki MATSUMOTO

    Abstract: A band-pass filter includes a first port, a second port, first to third high-pass filters provided between the first port and the second port in this order from a first-port side in a circuit configuration, and a low-pass filter provided between the second high-pass filter and the third high-pass filter in the circuit configuration. Each of the first to third high-pass filters forms an attenuation pole on a low-pass side of the passband. A frequency of the attenuation pole formed by the second high-pass filter is higher than a frequency of the attenuation pole formed by each of the first and third high-pass filters.

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