公开(公告)号：US20240290529A1

公开(公告)日：2024-08-29

申请号：US18582739

申请日：2024-02-21

Applicant: TDK Corporation

Inventor： Mitsuru MIURA ,  Tomonaga NISHIKAWA ,  Masaki ENDO ,  Kazufumi SHIOIRI ,  Futa GAKIYA ,  Hiroki NAKAGOMI

IPC: H01F17/00 ,  H01F27/29

CPC classification number: H01F17/0013 ,  H01F27/292

Abstract: Disclosed herein is a coil component that includes plural conductor layers embedded in the element body, first and second bump conductors, and first and second dummy bump conductors. Each of the conductor layers includes a coil pattern, first and second connection patterns respectively connected to the first and second bump conductors, and first and second dummy connection patterns respectively connected to the first and second dummy bump conductors. The conductor layers include first and second conductor layers. The first dummy connection pattern included in each of the first and second conductor layers has a cutout part. At least a part of the outer peripheral end of the coil pattern included in each of the first and second conductor layers is disposed within the cutout part.