公开(公告)号：US20240290529A1

公开(公告)日：2024-08-29

申请号：US18582739

申请日：2024-02-21

Applicant: TDK Corporation

Inventor： Mitsuru MIURA ,  Tomonaga NISHIKAWA ,  Masaki ENDO ,  Kazufumi SHIOIRI ,  Futa GAKIYA ,  Hiroki NAKAGOMI

IPC: H01F17/00 ,  H01F27/29

CPC classification number: H01F17/0013 ,  H01F27/292

Abstract: Disclosed herein is a coil component that includes plural conductor layers embedded in the element body, first and second bump conductors, and first and second dummy bump conductors. Each of the conductor layers includes a coil pattern, first and second connection patterns respectively connected to the first and second bump conductors, and first and second dummy connection patterns respectively connected to the first and second dummy bump conductors. The conductor layers include first and second conductor layers. The first dummy connection pattern included in each of the first and second conductor layers has a cutout part. At least a part of the outer peripheral end of the coil pattern included in each of the first and second conductor layers is disposed within the cutout part.

公开(公告)号：US20230138154A1

公开(公告)日：2023-05-04

申请号：US17910612

申请日：2021-03-12

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Futa GAKIYA ,  Akiyasu IIOKA ,  Kouichi TSUNODA ,  Kenichi YOSHIDA

IPC: H01L27/01

Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.