公开(公告)号：US20240242861A1

公开(公告)日：2024-07-18

申请号：US18537243

申请日：2023-12-12

Applicant: TDK Corporation

Inventor： Koki SHINOZAWA ,  Masayuki Uchida

IPC: H01C7/102 ,  H01C1/142

CPC classification number: H01C7/102 ,  H01C1/142

Abstract: In the chip varistor, the protruding lengths of the second portions of the first and second electrodes are shorter than the protruding lengths of the first portions of the third electrodes. Since the protruding lengths of the second portions are relatively short, distances between the first electrodes and the second electrodes on the side surfaces are secured, thereby suppressing short-circuiting. On the other hand, by making the protruding length of the first portion of the third electrode relatively long, the first portion becomes wide, the covering property of each end portion of the third conductor exposed on the side surface on which the third electrode is provided is enhanced, and the connectivity between the third conductor and the third electrode is improved.

公开(公告)号：US20190267192A1

公开(公告)日：2019-08-29

申请号：US16284677

申请日：2019-02-25

Applicant: TDK CORPORATION

Inventor： Jun SATO ,  Yukari WADA ,  Koki SHINOZAWA

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/20 ,  C04B35/64 ,  B32B18/00

Abstract: A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated. The green multilayer body 11 is formed on the temporary holding film 62 formed on the release substrate. The green multilayer body 11 is formed by repeating the first step forming a green functional part using the first ink containing the functional particles and the second step forming the green conductor part using the second ink containing the conductive particles. The temporary holding film 62 has conductivity.