公开(公告)号：US20220172894A1

公开(公告)日：2022-06-02

申请号：US17536319

申请日：2021-11-29

Applicant: TDK Corporation

Inventor： Suguru ANDOH ,  Hiroshi TAKASAKI ,  Hitoshi SAITA

IPC: H01G4/015 ,  H01G4/33

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film and including a plurality of capacitor areas divided by a slit and a plurality of fuse areas connecting two of adjacent capacitor areas. The second capacitive electrode has a structure in which a plurality of conductor films including a first conductor film and a second conductor film lower in electrical resistivity than the first conductor film are laminated.

公开(公告)号：US20190103220A1

公开(公告)日：2019-04-04

申请号：US16145231

申请日：2018-09-28

Applicant: TDK Corporation

Inventor： Masahiro HIRAOKA ,  Hitoshi SAITA ,  Suguru ANDOH ,  Atsuo MATSUTANI

IPC: H01G4/01 ,  H01G4/33 ,  H01G4/12

CPC classification number: H01G4/01 ,  H01G4/005 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/33 ,  H01G7/06

Abstract: Provided is a thin film capacitor that includes: a first electrode layer having a principal surface in which a plurality of recesses are provided; a dielectric layer laminated on the principal surface of the first electrode layer; and a second electrode layer laminated on the dielectric layer. When a depth of the recess is defined as FL and a thickness of the dielectric layer is defined as T, H/T is 0.05 or more and 0.5 or less.