公开(公告)号：US20130208401A1

公开(公告)日：2013-08-15

申请号：US13757058

申请日：2013-02-01

Applicant: TDK Corporation

Inventor： Yukihiko SHIRAKAWA ,  Yasuhito TAKAMATSU ,  Osamu HIROSE ,  Kazuhiro NAKAMURA ,  Daisuke HIROTA

IPC: H01G13/06 ,  H01G4/008

CPC classification number: H01G13/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component has an element body and an external electrode arranged on the element body. The element body has a pair of end faces opposed to each other, a pair of principal faces opposed to each other, and a pair of side faces opposed to each other. The external electrode is formed so as to cover the end face and a partial region of the principal face and/or a partial region of the side face. The external electrode has a thick film electrode, a thin film electrode, and a plated layer. The thick film electrode is formed on the end face. The thin film electrode is formed so as to cover the thick film electrode and the partial region of the principal face and/or the partial region of the side face. The plated layer is formed outside the thin film electrode and contains Sn or an Sn alloy.

Abstract translation: 电子部件具有设置在元件主体上的元件主体和外部电极。 元件主体具有彼此相对的一对端面，彼此相对的一对主面以及彼此相对的一对侧面。 外部电极形成为覆盖主面的端面和主面的部分区域和/或侧面的部分区域。 外部电极具有厚膜电极，薄膜电极和镀层。 厚膜电极形成在端面上。 形成薄膜电极以覆盖厚膜电极以及侧面的主面和/或部分区域的部分区域。 电镀层形成在薄膜电极的外侧，并含有Sn或Sn合金。