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    SENSOR UNIT
    2.
    发明申请
    SENSOR UNIT 审中-公开

    公开(公告)号：US20200209324A1

    公开(公告)日：2020-07-02

    申请号：US16816685

    申请日：2020-03-12

    Applicant: TDK CORPORATION

    Inventor： Kunihiro UEDA ,  Yoshimitsu WADA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Tsuyoshi UMEHARA

    IPC: G01R33/00 ,  G01R33/09

    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.

    MAGNETIC SENSOR
    4.
    发明申请
    MAGNETIC SENSOR 有权
    磁传感器

    公开(公告)号：US20150054498A1

    公开(公告)日：2015-02-26

    申请号：US14335248

    申请日：2014-07-18

    Applicant: TDK CORPORATION

    Inventor： Yoshimitsu WADA ,  Nozomu HACHISUKA ,  Yoshihiro KUDO ,  Jun ONO ,  Nobutaka NISHIO

    IPC: G01R33/09

    CPC classification number: G01R33/098 ,  G01R33/091

    Abstract: The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.

    Abstract translation: 本发明的磁传感器包括基座部分，位于基座部分上的传感器芯片，适于将传感器芯片的端子与连接引线电连接的布线部分，具有低弹性模量的树脂至少涂覆 传感器芯片和具有高弹性模量的树脂，用于至少涂覆低弹性模量树脂和布线部分，其中传感器芯片包括磁阻效应器件，并且低弹性模量树脂具有弹性模量范围 10psi〜80MPa，高弹性模量树脂的弹性模量为1GPa以上，能够使传感器芯片在良好的状态下良好地进行良好的动作，同时具有利用树脂部件密封传感器芯片的结构。

    MAGNETIC SENSOR DEVICE
    6.
    发明申请
    MAGNETIC SENSOR DEVICE 审中-公开
    磁传感器装置

    公开(公告)号：US20170052232A1

    公开(公告)日：2017-02-23

    申请号：US15196194

    申请日：2016-06-29

    Applicant: TDK Corporation

    Inventor： Yoshimitsu WADA ,  Kunihiro UEDA

    IPC: G01R33/09

    CPC classification number: G01R33/091 ,  G01R33/093 ,  G01R33/098 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A magnetic sensor device that can prevent an increase in detection error even when stress is applied to a magnetic sensor chip due to heat generation or the like at the time of operation includes a magnetic sensor chip that has a nearly-square shape in a plan view, and a die pad having a mounting surface where the magnetic sensor chip is mounted. Opening portions are formed at positions where four corners of the magnetic sensor chip mounted on the mounting surface overlap, respectively. An area ratio of the opening portions to an area of the die pad is 20% or greater. Also, an area of the overlapped portions with the magnetic sensor chip and the opening portions is 40% or greater relative to the area of the opening portions in a plan view of the die pad.

    Abstract translation: 即使在操作时由于发热等而对磁传感器芯片施加应力也能够防止检测误差增大的磁传感器装置包括在俯视图中具有近似正方形的磁传感器芯片 以及具有安装有磁性传感器芯片的安装面的芯片焊盘。 开口部形成在安装在安装面上的磁传感器芯片的四个角分别重叠的位置。 开口部与面板的面积的面积比为20％以上。 此外，与芯片垫的平面图相比，与磁性传感器芯片和开口部分重叠的部分的面积相对于开口部分的面积为40％以上。

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