公开(公告)号：US11177059B2

公开(公告)日：2021-11-16

申请号：US16603809

申请日：2018-04-12

Applicant: TDK Electronics AG

Inventor： Bettina Milke ,  Bernhard Ostrick

IPC: H01C17/075 ,  G01B7/16 ,  G01L1/18 ,  G01L1/22 ,  H01C10/10

Abstract: A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a M1+nAXn phase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.

公开(公告)号：US11676743B2

公开(公告)日：2023-06-13

申请号：US16624716

申请日：2018-06-18

Applicant: TDK Electronics AG

Inventor： Bettina Milke ,  Bernhard Ostrick

IPC: G01L1/18 ,  H01C7/00 ,  G01L9/00 ,  H01C17/065

CPC classification number: H01C7/006 ,  G01L1/18 ,  G01L9/0055 ,  H01C17/0652

Abstract: A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.

公开(公告)号：US20240219245A1

公开(公告)日：2024-07-04

申请号：US18556085

申请日：2022-04-26

Applicant: TDK Electronics AG

Inventor： Markus Wehring ,  Conall Dodd ,  Jordi Basiana Martí ,  Carsten Dehoff ,  Bernhard Ostrick

IPC: G01K7/22 ,  G01K1/08 ,  G01K1/14 ,  G01K1/16

CPC classification number: G01K7/223 ,  G01K1/08 ,  G01K1/14 ,  G01K1/16

Abstract: The invention relates to a test arrangement comprising a test body and a temperature sensor for measuring the temperature thereof, as well as a correspondingly suitable temperature sensor. In the test arrangement, a temperature sensitive element of the temperature sensor is at least partially recessed into a recess in the test body by insertion into the recess.

公开(公告)号：US12287246B2

公开(公告)日：2025-04-29

申请号：US17639781

申请日：2021-08-31

Applicant: TDK Electronics AG

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

IPC: G01K7/20 ,  B81C1/00 ,  G01K7/16

Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US20220357214A1

公开(公告)日：2022-11-10

申请号：US17639781

申请日：2021-08-31

Applicant: TDK Electronics AG ,  Tronics MEMS, Inc.

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

IPC: G01K7/20

Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.