公开(公告)号：US20210402522A1

公开(公告)日：2021-12-30

申请号：US17292875

申请日：2019-11-18

申请人： TDK Electronics AG ,  Bundesanstalt für Materialforschung und - prüfung (BAM)

发明人： Markus Eberstein ,  Jörn Bonse ,  Sabrina V. Kirner

IPC分类号： B23K26/362 ,  G01L19/06 ,  B23K26/0622

摘要： In an embodiment a sensor device includes a sensor element, a media supply configured to transport a medium to the sensor element and a surface, wherein the surface is configured to be exposed to the medium during operation of the sensor device, and wherein the surface comprises a surface structure configured to reduce a wettability of the surface by the medium.

公开(公告)号：US12097574B2

公开(公告)日：2024-09-24

申请号：US17292875

申请日：2019-11-18

申请人： TDK Electronics AG

发明人： Markus Eberstein ,  Jörn Bonse ,  Sabrina V. Kirner

IPC分类号： B23K26/362 ,  B23K26/0622 ,  G01L19/06

CPC分类号： B23K26/362 ,  B23K26/0624 ,  G01L19/0654

摘要： In an embodiment a sensor device includes a sensor element, a media supply configured to transport a medium to the sensor element and a surface, wherein the surface is configured to be exposed to the medium during operation of the sensor device, and wherein the surface comprises a surface structure configured to reduce a wettability of the surface by the medium.