公开(公告)号：US20210055539A1

公开(公告)日：2021-02-25

申请号：US16750441

申请日：2020-01-23

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Che-Wei CHANG ,  Chih-Wen CHIANG ,  Chen-Er HSU ,  Fu-Yuan WU ,  Shou-Jen LIU ,  Chih-Wei WENG ,  Mao-Kuo HSU ,  Hsueh-Ju LU ,  Che-Hsiang CHIU

IPC: G02B26/00 ,  G02B3/12

Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly, and the movable element is connected to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly.

公开(公告)号：US20200209516A1

公开(公告)日：2020-07-02

申请号：US16729127

申请日：2019-12-27

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Che-Wei CHANG ,  Chih-Wen CHIANG ,  Chen-Er HSU ,  Fu-Yuan WU ,  Shou-Jen LIU ,  Chih-Wei WENG ,  Mao-Kuo HSU ,  Hsueh-Ju LU ,  Che-Hsiang CHIU

IPC: G02B7/09 ,  G02B3/12 ,  G02B26/00 ,  G02B27/64 ,  G03B13/36 ,  G03B5/00

Abstract: An optical system is provided and includes a fixed assembly, a movable element, a movable assembly, a driving module and a stopping assembly. The fixed assembly defines a main axis. The movable element is movable relative to the fixed assembly and is connected to a first optical element. The movable assembly is connected to the movable element. The driving module is configured to drive the movable assembly so as to drive the movable element to move relative to the fixed assembly. The stopping assembly is configured to limit the range of motion of the movable element.

公开(公告)号：US20240272401A1

公开(公告)日：2024-08-15

申请号：US18647373

申请日：2024-04-26

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU

IPC: G02B7/10 ,  G02B7/02 ,  G02B7/09 ,  G03B17/02 ,  G03B17/12 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

CPC classification number: G02B7/10 ,  G02B7/021 ,  G02B7/026 ,  G02B7/09 ,  G03B17/02 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  G03B17/12 ,  G03B2205/0069

Abstract: A camera module is provided, including a lens holder, a driving mechanism, a frame, a base, a sensing element, and a plurality of three-dimensional circuits. The lens holder carries a lens with an optical axis. The driving mechanism is configured to drive the lens holder along the optical axis. The frame receives the driving mechanism and the lens holder therein. The base supports the frame, and a recess is formed on the bottom of the base. Specifically, the recess is formed by the outer periphery of the bottom of the base extending toward the light-exit direction of the optical axis. The sensing element is disposed in the recess. The three-dimensional circuits are formed in the recess and electrically connected to the sensing element and the driving mechanism.

公开(公告)号：US20210191067A1

公开(公告)日：2021-06-24

申请号：US16729111

申请日：2019-12-27

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Che-Wei CHANG ,  Chih-Wen CHIANG ,  Chen-Er HSU ,  Fu-Yuan WU ,  Shou-Jen LIU ,  Chih-Wei WENG ,  Mao-Kuo HSU ,  Hsueh-Ju LU ,  Che-Hsiang CHIU

IPC: G02B7/09 ,  G02B3/12 ,  G02B26/00 ,  G02B27/64 ,  G03B13/36 ,  G03B5/00

Abstract: An optical system is provided and includes a fixed assembly, a movable element, a movable assembly, and a driving module. The fixed assembly defines a main axis, and the fixed assembly has a casing on which a casing opening is formed, corresponding to the main axis. The movable element is movable relative to the fixed assembly and is connected to a first optical element. The movable assembly is connected to the movable element. The driving module is configured to drive the movable assembly so as to drive the movable element to move relative to the fixed assembly. The first optical element has a first section and a second section. When viewed along the main axis, the size of the first section is larger than the size of the casing opening, and the size of the second section is smaller than the size of the casing opening.

公开(公告)号：US20200335539A1

公开(公告)日：2020-10-22

申请号：US16851808

申请日：2020-04-17

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU ,  Sin-Jhong SONG ,  Chi-Fu WU ,  Hao-Yu WU ,  Tsutomu FUKAI ,  Ming-Hung WU

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/024 ,  H01L31/0224

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

公开(公告)号：US20200209513A1

公开(公告)日：2020-07-02

申请号：US16728639

申请日：2019-12-27

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Che-Wei CHANG ,  Chih-Wen CHIANG ,  Chen-Er HSU ,  Fu-Yuan WU ,  Shou-Jen LIU ,  Chih-Wei WENG ,  Mao-Kuo HSU ,  Hsueh-Ju LU ,  Che-Hsiang CHIU

IPC: G02B7/09 ,  G02B26/00 ,  G02B27/64 ,  G03B13/36 ,  G03B5/00

Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly and coupled to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly. The driving module includes a first driving assembly and a second driving assembly, and the first driving assembly and the second driving assembly are individually operable.

公开(公告)号：US20190285782A1

公开(公告)日：2019-09-19

申请号：US16354508

申请日：2019-03-15

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU ,  Sin-Jhong SONG

IPC: G02B5/20 ,  H05K5/02 ,  G02B7/02 ,  G02B7/04 ,  H01L27/146 ,  H04N5/225

Abstract: A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first transparent plate, an image sensor, and a first plastic member. The base assembly includes a substrate having a main body that includes a metal material. The first transparent plate is located on the first side of the base assembly. The image sensor is located on the second side of the base assembly and adjacent to the main body, wherein the first side is opposite the second side. The substrate is disposed between the image sensor and the first transparent plate. The first plastic member is connected to the base assembly. The image sensor is surrounded by the first plastic member. When the photosensitive module receives light, the light passes through the first transparent plate and an opening of the main body sequentially to the image sensor.

公开(公告)号：US20180164539A1

公开(公告)日：2018-06-14

申请号：US15711358

申请日：2017-09-21

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU

IPC: G02B7/10 ,  H04N5/225

CPC classification number: G02B7/10 ,  G02B7/021 ,  G02B7/026 ,  G02B7/09 ,  G03B17/02 ,  G03B17/12 ,  G03B2205/0069 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: A camera module is provided, including a lens holder, a driving mechanism, a frame, a base, a sensing element, and a plurality of three-dimensional circuits. The lens holder carries a lens with an optical axis. The driving mechanism is configured to drive the lens holder along the optical axis. The frame receives the driving mechanism and the lens holder therein. The base supports the frame, and a recess is formed on the bottom of the base. Specifically, the recess is formed by the outer periphery of the bottom of the base extending toward the light-exit direction of the optical axis. The sensing element is disposed in the recess. The three-dimensional circuits are formed in the recess and electrically connected to the sensing element and the driving mechanism.

公开(公告)号：US20230122268A1

公开(公告)日：2023-04-20

申请号：US18085077

申请日：2022-12-20

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU ,  Sin-Jhong SONG

IPC: G02B5/20 ,  H05K5/02 ,  G02B7/02 ,  H01L27/146 ,  G02B7/04 ,  H04N23/52 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

Abstract: A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first plastic member, a first lead assembly, an image sensor, and an opening. The base assembly includes a substrate, an insulating layer, and a circuit layer. The substrate has a main body that includes a metal material. The first plastic member is connected to the base assembly. The first plastic member encapsulates at least part of the lead assembly. The image sensor is for receiving a light and is electrically connected to the circuit layer via the lead assembly. The opening is formed at the main body, and corresponds to the image sensor. When observed along a direction in which the light travels, the opening overlaps the image sensor.

公开(公告)号：US20210191065A1

公开(公告)日：2021-06-24

申请号：US16728861

申请日：2019-12-27

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Che-Wei CHANG ,  Chen-Er HSU

IPC: G02B7/04 ,  H04N5/225 ,  G02B27/64 ,  H04N5/232 ,  G02B26/00 ,  G02B3/00 ,  G03B5/00

Abstract: A driving mechanism for an optical element is provided, having an optical axis, including a movable part, a fixed part and a driving assembly. The fixed part includes a sidewall parallel to the optical axis. The driving assembly drives the movable part to move relative to the fixed part. The sidewall is not in contact with the driving assembly.