公开(公告)号：US20200185327A1

公开(公告)日：2020-06-11

申请号：US16430993

申请日：2019-06-04

Applicant: TDK TAIWAN CORP.

Inventor： An-Ping TSENG ,  Chi-Fu WU ,  Hao-Yu WU ,  Ming-Hung WU ,  Chun-Yang TAI ,  Tsutomu FUKAI

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/04 ,  H01L23/64 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  B81B7/00

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

公开(公告)号：US20190139854A1

公开(公告)日：2019-05-09

申请号：US16176971

申请日：2018-10-31

Applicant: TDK TAIWAN CORP.

Inventor： Ming-Hung WU ,  Chi-Fu WU ,  An-Ping TSENG ,  Hao-Yu WU

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/532 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/53209 ,  H01L23/53295 ,  H01L23/5389 ,  H01L2224/18

Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.

公开(公告)号：US20200335539A1

公开(公告)日：2020-10-22

申请号：US16851808

申请日：2020-04-17

Applicant: TDK TAIWAN CORP.

Inventor： Chen-Er HSU ,  Sin-Jhong SONG ,  Chi-Fu WU ,  Hao-Yu WU ,  Tsutomu FUKAI ,  Ming-Hung WU

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/024 ,  H01L31/0224

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

公开(公告)号：US20190139860A1

公开(公告)日：2019-05-09

申请号：US16183128

申请日：2018-11-07

Applicant: TDK TAIWAN CORP.

Inventor： Ming-Hung WU ,  Chi-Fu WU ,  An-Ping TSENG ,  Hao-Yu WU

IPC: H01L23/373 ,  H01L23/522 ,  H01L23/367

Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.