公开(公告)号：US12089357B2

公开(公告)日：2024-09-10

申请号：US17958540

申请日：2022-10-03

Applicant: TE Connectivity Solutions GmbH

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H05K7/10 ,  H01R12/70 ,  H01R12/71

CPC classification number: H05K7/1084 ,  H01R12/7076 ,  H01R12/714 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/2018

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

公开(公告)号：US20230025397A1

公开(公告)日：2023-01-26

申请号：US17958540

申请日：2022-10-03

Applicant: TE Connectivity Solutions GmbH

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H05K7/10 ,  H01R12/71 ,  H01R12/70

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.