公开(公告)号：US20150123160A1

公开(公告)日：2015-05-07

申请号：US14072915

申请日：2013-11-06

申请人： TEKCORE CO., LTD.

发明人： Hai-Wen Hsu ,  Hsin-Hsiang Tseng ,  Ruei-Ming Yang

IPC分类号： H01L33/38 ,  H01L33/48

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/14 ,  H01L2924/19107

摘要： A flip chip light-emitting diode (LED) package structure includes a circuit board, an electrical conducting layer and a plurality of flip chip light-emitting elements. The circuit board includes a bearing surface. The electrical conducting layer is formed on the bearing surface, and includes a plurality of electrical connection regions independent of each other. Each flip chip light-emitting element includes a p-type electrode and an n-type electrode. The p-type electrodes and the n-type electrodes of the flip chip light-emitting elements are electrically connected to the electrical connection regions, so that the flip chip light-emitting elements are electrically connected in series to form a package structure. During packaging of the flip chip light-emitting elements, the structure formed by the serial connection forms a circuit that can withstand a high voltage, and further reduce the current.

摘要翻译： 倒装芯片发光二极管（LED）封装结构包括电路板，导电层和多个倒装芯片发光元件。 电路板包括一个支承面。 导电层形成在轴承表面上，并且包括彼此独立的多个电连接区域。 每个倒装芯片发光元件包括p型电极和n型电极。 倒装芯片发光元件的p型电极和n型电极电连接到电连接区域，使得倒装芯片发光元件串联电连接以形成封装结构。 在封装倒装芯片发光元件的过程中，通过串联形成的结构形成可承受高电压的电路，并进一步降低电流。