公开(公告)号：US20150068560A1

公开(公告)日：2015-03-12

申请号：US14022979

申请日：2013-09-10

申请人： TEL FSI, Inc.

发明人： Mark GOLUCH ,  David C. ZIMMERMAN ,  Robert E. LARSON ,  Edward Deneen HANZLIK ,  Gregory Paul THOMES ,  Christina Ann RATHMAN

IPC分类号： H01L21/67 ,  B08B5/02

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B3/022 ,  B08B3/024 ,  B08B3/04 ,  B08B5/02 ,  B08B15/023 ,  H01L21/02057 ,  H01L21/67023 ,  H01L21/6708 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68792

摘要： An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the apparatus are described. In particular, the apparatus includes a treatment chamber defining an interior space to treat the microelectronic workpiece with at least one fluid within the treatment chamber, and a movable chuck that supports the workpiece within the treatment chamber. The apparatus further includes a workpiece translational drive system configured to translate the movable chuck between a workpiece load position and at least one processing position at which the workpiece is treated with the at least one fluid using at least one nozzle connected to at least one fluid supply, and a workpiece rotational drive system configured to rotate the microelectronic workpiece.

摘要翻译： 描述了通过至少一种流体冲击表面来处理微电子工件的表面的装置和用于操作该装置的方法。 特别地，该设备包括处理室，其限定内部空间以利用处理室内的至少一个流体处理微电子工件;以及可移动卡盘，其在处理室内支撑工件。 该装置还包括工件平移驱动系统，该工件平移驱动系统构造成使用至少一个连接至少一个流体供应器的喷嘴将可动夹头在工件装载位置与至少一个处理位置之间平移， 以及构造成旋转微电子工件的工件旋转驱动系统。