Abstract:
A spot-size converter for coupling light between first and second waveguides respectively supporting first and second propagation modes having substantially different dimensions is provided. The spot-size converter includes a lower and an upper waveguiding structure each characterized by an effective refractive index. The lower waveguiding structure is coupled to the first waveguide to receive light therefrom or transmit light thereto in the first propagation mode. The upper waveguiding structure is coupled to the second waveguide to transmit light thereto or receive light therefrom in the second propagation mode. The upper waveguiding structure includes a plurality of longitudinally extending high-index elements arranged in multiple vertically spaced rows. At least part of the upper waveguiding structure extends at least partially over the lower waveguiding structure so as to define a coupling region wherein an effective refractive index crossing occurs, thereby enabling evanescent coupling of light between the lower and upper waveguiding structures.
Abstract:
A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.