公开(公告)号：US20100108117A1

公开(公告)日：2010-05-06

申请号：US12607210

申请日：2009-10-28

申请人： TETSUTSUGU HAMANO ,  Hiroyuki Yamashita ,  Naoshi Horiai

发明人： TETSUTSUGU HAMANO ,  Hiroyuki Yamashita ,  Naoshi Horiai

IPC分类号： H01L35/20 ,  B23K31/02

CPC分类号： H01L35/34 ,  B23K1/0016 ,  B23K2101/40 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A package is adapted to a thermoelectric module in which a plurality of thermoelectric elements is electrically connected in series and aligned between a lower electrode and an upper electrode and is constituted of a metal frame and a metal base which is a metal plate having good thermal conductivity composed of copper, aluminum, silver, or alloy. The metal frame is bonded onto the periphery of the metal base via a low melting point solder whose melting point is lower than that of the solder used for forming the thermoelectric module. The thermoelectric module is circumscribed by the metal frame so that the lower electrode thereof is attached onto the metal base via an insulating resin layer.

摘要翻译： 一种封装适用于其中多个热电元件串联电连接并且在下电极和上电极之间对准的热电模块，并且由金属框架和作为具有良好导热性的金属板的金属基座构成 由铜，铝，银或合金组成。 金属框架通过熔点比用于形成热电模块的焊料的熔点低的低熔点焊料结合到金属基体的周边。 热电模块由金属框架外接，使得其下电极经由绝缘树脂层附接到金属基底上。