公开(公告)号：US20230197579A1

公开(公告)日：2023-06-22

申请号：US17750270

申请日：2022-05-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Xingfang Ma ,  Juan Herbsommer ,  Tiange Xie ,  Alex Chin Sern Ting

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/49503

Abstract: An integrated circuit package includes a first die attach pad (DAP) having a first bottom surface, a first semiconductor die attached to the first DAP, a second DAP having a second bottom surface, wherein the first bottom surface and the second bottom surface are coplanar, and a second semiconductor die attached to the second DAP. A nonlinear DAP linking structure couples the first DAP to the second DAP, wherein the DAP linking structure does not include any direct linear connections between the first DAP and the second DAP. The nonlinear DAP linking structure is configured to deform without causing the first DAP and the second DAP to become non-coplanar. A mold compound covers the first and second DAPs, the first and second semiconductor dies, and the nonlinear DAP linking structure.

公开(公告)号：US12224181B2

公开(公告)日：2025-02-11

申请号：US17458653

申请日：2021-08-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tiange Xie ,  Li Xiang Zheng ,  Alex Chin Sern Ting ,  Zhenzhen He

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/495

Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.