公开(公告)号：US12224181B2

公开(公告)日：2025-02-11

申请号：US17458653

申请日：2021-08-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tiange Xie ,  Li Xiang Zheng ,  Alex Chin Sern Ting ,  Zhenzhen He

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/495

Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.