公开(公告)号：US20200211928A1

公开(公告)日：2020-07-02

申请号：US16235419

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dishit Paresh PAREKH ,  Benjamin Stassen COOK ,  Daniel Lee REVIER ,  Jo BITO

IPC: H01L23/473 ,  H01L23/42 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.

公开(公告)号：US20180326462A1

公开(公告)日：2018-11-15

申请号：US15591311

申请日：2017-05-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daniel Lee REVIER ,  Benjamin Stassen COOK ,  David Patrick MAGEE ,  Stephen John FEDIGAN

IPC: B08B3/10 ,  G01H13/00 ,  G01D5/24

CPC classification number: B08B3/102 ,  G01D5/24 ,  G01H13/00

Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.

公开(公告)号：US20190148823A1

公开(公告)日：2019-05-16

申请号：US16181627

申请日：2018-11-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Leon STIBOREK ,  Alexey BERD ,  Daniel Lee REVIER

IPC: H01Q1/38 ,  H01Q13/16

Abstract: An antenna includes a metal member having a surface that includes a slot. The metal member includes a plurality of legs orthogonal to the surface of the metal member. The plurality of legs are configured to be attached to a circuit board. A first dielectric material is in the slot.