公开(公告)号：US20200211928A1

公开(公告)日：2020-07-02

申请号：US16235419

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dishit Paresh PAREKH ,  Benjamin Stassen COOK ,  Daniel Lee REVIER ,  Jo BITO

IPC: H01L23/473 ,  H01L23/42 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.