公开(公告)号：US20240246317A1

公开(公告)日：2024-07-25

申请号：US18585500

申请日：2024-02-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Luigi COLOMBO ,  Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL

IPC: B32B9/00 ,  B32B9/04 ,  B82Y30/00 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00

CPC classification number: B32B9/007 ,  B32B9/041 ,  B32B9/045 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00 ,  B32B2305/38 ,  B32B2457/14 ,  B82Y30/00 ,  C01P2002/20 ,  Y10T428/30

Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.

公开(公告)号：US20200321303A1

公开(公告)日：2020-10-08

申请号：US16843580

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L23/31

Abstract: In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.

公开(公告)号：US20190202696A1

公开(公告)日：2019-07-04

申请号：US16230070

申请日：2018-12-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Luigi COLOMBO ,  Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL

IPC: C01B21/064 ,  C23C16/34 ,  C23C18/32 ,  C23C18/16

CPC classification number: C01B21/0648 ,  C01P2004/22 ,  C01P2004/30 ,  C23C16/342 ,  C23C18/1641 ,  C23C18/32 ,  G03F1/20 ,  G03F1/60

Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.

公开(公告)号：US20190074233A1

公开(公告)日：2019-03-07

申请号：US15697505

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK

IPC: H01L23/08 ,  B81C1/00 ,  H01L21/768

CPC classification number: H01L23/08 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  G04F5/14 ,  H01L21/76898

Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

公开(公告)号：US20240077514A1

公开(公告)日：2024-03-07

申请号：US18507150

申请日：2023-11-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK

IPC: G01P21/00 ,  G01P15/09

CPC classification number: G01P21/00 ,  G01P15/09

Abstract: A method comprises receiving a signal from a piezoelectric device and receiving a measurement of a temperature of the piezoelectric device. The method further comprises reading a first parameter from a memory, in which the first parameter depends on the temperature and relates the signal to an acceleration value and reading a second parameter from the memory, in which the second parameter represents a degree of drift of the piezoelectric device at the temperature. The method further comprises determining an acceleration of the piezoelectric device based on the signal, the first parameter, and the second parameter.

公开(公告)号：US20230093214A1

公开(公告)日：2023-03-23

申请号：US18059473

申请日：2022-11-29

Applicant: Texas Instruments Incorporated

Inventor： Steven Alfred KUMMERL ,  Benjamin Stassen COOK

IPC: H01L23/14 ,  H01L21/48 ,  H01L23/498 ,  H01L21/78

Abstract: An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.

公开(公告)号：US20220223486A1

公开(公告)日：2022-07-14

申请号：US17538850

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Michael SZELONG ,  Ernst MUELLNER ,  Jeronimo SEGOVIA-FERNANDEZ

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  G01L1/18

Abstract: An example semiconductor package includes a semiconductor die configured to detect a force. In addition, the semiconductor package includes a mold compound covering the semiconductor die. Further, the semiconductor package includes an engagement surface including a pattern of projections adapted to engage with a mounting surface on a member of interest.

公开(公告)号：US20220169773A1

公开(公告)日：2022-06-02

申请号：US17675055

申请日：2022-02-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL ,  Luigi COLOMBO

IPC: C08F292/00 ,  C08F8/42 ,  C08L33/12 ,  C08K3/08 ,  C08K7/00 ,  C08J5/24 ,  G03F1/78 ,  C08K3/04 ,  C08J5/00

Abstract: A method of forming a composite material includes photo-initiating a polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice. Unpolymerized monomer is removed from the polymer microlattice. The polymer microlattice is coated with a metal. The metal-coated polymer microlattice is dispersed in a polymer matrix.

公开(公告)号：US20200321267A1

公开(公告)日：2020-10-08

申请号：US16843618

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/495

Abstract: In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.

公开(公告)号：US20200211928A1

公开(公告)日：2020-07-02

申请号：US16235419

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dishit Paresh PAREKH ,  Benjamin Stassen COOK ,  Daniel Lee REVIER ,  Jo BITO

IPC: H01L23/473 ,  H01L23/42 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.