公开(公告)号：US10297497B2

公开(公告)日：2019-05-21

申请号：US15658039

申请日：2017-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian Meier ,  Helmut Rinck ,  Kai-Alexander Schachtschneider ,  Fromund Metz ,  Mario Schmidpeter ,  Javier Gustavo Moreira

IPC: H01L21/285 ,  H01L21/311 ,  H01L21/768 ,  H01L21/3213

Abstract: In accordance with at least one embodiment of the disclosure, a method of patterning platinum on a substrate is disclosed. In an embodiment, an adhesive layer is deposited over the substrate, a sacrificial layer is deposited over the adhesive layer, and a patterned photoresist layer is formed over the sacrificial layer. Then, the sacrificial layer is patterned utilizing the photoresist layer as a mask such that at least a portion of the adhesive layer is exposed. Subsequently, the top and sidewall surfaces of the patterned sacrificial layer and the first portion of the adhesive layer are covered by a platinum layer. Finally, the sacrificial layer and a portion of the platinum layer covering the top and sidewall surfaces of the sacrificial layer are etched, thereby leaving a remaining portion of the platinum layer to form a patterned platinum layer on the substrate.