公开(公告)号：US12135415B2

公开(公告)日：2024-11-05

申请号：US17398907

申请日：2021-08-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William Craig McDonald ,  James Norman Hall ,  Kelly Jay Taylor ,  Song Zheng

IPC: G02B26/08 ,  G02B7/182 ,  H02N1/00

Abstract: A system includes a hinge structure. The hinge structure includes four support posts and four hinges, each hinge coupled to an edge of a support post and to a plate of the hinge structure, where each hinge includes two 90° turns. The system also includes a mirror coupled to the hinge structure and an electrode structure coupled to the hinge structure.

公开(公告)号：US10029908B1

公开(公告)日：2018-07-24

申请号：US15395029

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing ,  Kelly Jay Taylor

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

Abstract: In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.

公开(公告)号：US12252396B2

公开(公告)日：2025-03-18

申请号：US17728844

申请日：2022-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Murray Beard ,  Song Zheng ,  John Wesley Hamlin, III ,  Win-Jae Jessie Yuan ,  Kelly Jay Taylor ,  Jose Antonio Martinez Soto

IPC: B81C1/00

Abstract: In an example, a method includes depositing an organic polymer layer on one or more material layers. The method also includes thermally curing the organic polymer layer. The method includes depositing a hard mask on the organic polymer layer and depositing a photoresist layer on the hard mask. The method also includes patterning the photoresist layer to expose at least a portion of the hard mask. The method includes etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer. The method also includes etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers.

公开(公告)号：US20210354977A1

公开(公告)日：2021-11-18

申请号：US17320188

申请日：2021-05-13

Applicant: Texas Instruments Incorporated

Inventor： Scott Robert Summerfelt ,  Adam Joseph Fruehling ,  Kelly Jay Taylor

IPC: B81B3/00

Abstract: In described examples, a microelectromechanical system (MEMS) is located on a substrate. A silicon nitride (SiN) layer on a portion of the substrate. A mechanical structure has first and second ends. The first end is embedded in the SiN layer, and the second end is cantilevered from the SiN layer.