公开(公告)号：US20200211767A1

公开(公告)日：2020-07-02

申请号：US16233804

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin HOU ,  Sombuddha CHAKRABORTY ,  Kenji KAWANO ,  Jeffrey MORRONI ,  Yuki SATO

IPC: H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F27/24 ,  H01F41/00 ,  H02M3/158

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.