公开(公告)号：US20230387817A1

公开(公告)日：2023-11-30

申请号：US17829035

申请日：2022-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sombuddha CHAKRABORTY ,  Taisuke KAZAMA ,  Nicola BERTONI ,  Dongbin HOU ,  Raul BLECIC ,  Stefan HERZER

IPC: H02M3/335 ,  H02M1/00

CPC classification number: H02M3/33592 ,  H02M1/0058

Abstract: A voltage converter includes a switch network, a rectifier, and a transformer coupled between the switch network and the rectifier. The voltage converter includes an adaptive ON-time generation circuit having a control input and a control output, the control input. The adaptive ON-time generation circuit is configured to receive a WAKE signal to turn ON the switch network, generate a signal indicative of an OFF time of the switch network, and determine an ON time for the switch network based on the signal indicative of the OFF time.

公开(公告)号：US20230386731A1

公开(公告)日：2023-11-30

申请号：US17829073

申请日：2022-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nicola BERTONI ,  Raul BLECIC ,  Dongbin HOU

IPC: H01F27/28

CPC classification number: H01F27/2885 ,  H01F27/2876

Abstract: An apparatus includes a substrate and first through fourth conductive layers. The first conductive layer is on the substrate and includes a first electromagnetic interference (EMI) shield. The second conductive layer is over the first conductive layer opposite the substrate and includes a first winding of a transformer. The third conductive layer is over the second conductive layer opposite the first conductive layer and includes a second EMI shield. The fourth conductive layer is over the third conductive layer opposite the second conductive layer and includes a second winding of the transformer.

公开(公告)号：US20200211959A1

公开(公告)日：2020-07-02

申请号：US16232684

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin HOU ,  Steven Alfred KUMMERL ,  Roberto Giampiero MASSOLINI ,  Joyce Marie MULLENIX

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/29

Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

公开(公告)号：US20200211767A1

公开(公告)日：2020-07-02

申请号：US16233804

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin HOU ,  Sombuddha CHAKRABORTY ,  Kenji KAWANO ,  Jeffrey MORRONI ,  Yuki SATO

IPC: H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F27/24 ,  H01F41/00 ,  H02M3/158

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.