公开(公告)号：US20200211767A1

公开(公告)日：2020-07-02

申请号：US16233804

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin HOU ,  Sombuddha CHAKRABORTY ,  Kenji KAWANO ,  Jeffrey MORRONI ,  Yuki SATO

IPC: H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F27/24 ,  H01F41/00 ,  H02M3/158

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.

公开(公告)号：US20230018894A1

公开(公告)日：2023-01-19

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin ZHANG ,  Kenji OTAKE ,  Yi YAN ,  Jeffrey MORRONI ,  Yuki SATO ,  Takafumi ANDO

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20200212809A1

公开(公告)日：2020-07-02

申请号：US16233168

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Shailendra Kumar BARANWAL ,  Jeffrey MORRONI

IPC: H02M3/335

Abstract: A power converter includes a first switch with a first transistor having a first blocking voltage in parallel with a second transistor having a second blocking voltage that is higher than the first blocking voltage. The power converter also includes a second switch. The power converter also includes a controller coupled to the first and second switches and configured to provide switch control signals. The power converter also includes a sequencer coupled to the first and second transistors and configured to generate offset transition signals for the first and second transistors based on a switch control signal provided by the controller.

公开(公告)号：US20170126122A1

公开(公告)日：2017-05-04

申请号：US14932705

申请日：2015-11-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Monodeep KAR ,  Saurav BANDYOPADHYAY ,  Jeffrey MORRONI

IPC: H02M3/158

CPC classification number: H02M3/1588 ,  Y02B70/1466

Abstract: A power converter includes a power stage having a switch-node of a switched-mode power supply that is coupled to an input voltage node by a power field-effect transistor (FET) to energize an inductive circuit and is coupled to a ground node by a synchronous rectifier in parallel with the inductive circuit. The power converter also includes a controller coupled to the power stage. The controller controls switching of the power FET and synchronous rectifier in a complimentary manner. The controller switches on the power FET during a first switching cycle. Subsequently, the controller switches on the synchronous rectifier and, in response to a current through the inductive circuit being approximately zero, switches off the synchronous rectifier. Subsequently, the controller switches on the synchronous rectifier again to generate a negative current through the inductive circuit prior to entering a second switching cycle.

公开(公告)号：US20210091016A1

公开(公告)日：2021-03-25

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin ZHANG ,  Kenji OTAKE ,  Yi YAN ,  Jeffrey MORRONI ,  Yuki SATO ,  Takafumi ANDO

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01F27/02 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01L21/48

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20190207513A1

公开(公告)日：2019-07-04

申请号：US16224457

申请日：2018-12-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yogesh Kumar RAMADASS ,  Jeffrey MORRONI

IPC: H02M3/07 ,  H02M7/219 ,  H02M1/00

Abstract: A capacitor-drop power supply includes a rectifier and a switched capacitor converter coupled to the rectifier. The rectifier is configured to receive an alternating current (AC) signal at an AC voltage and convert the AC signal into a rectified direct current (DC) signal at a rectified voltage. The switched capacitor converter is configured to receive the rectified DC signal and generate a converter output signal at a converter voltage that is proportional to the rectified voltage and that is less than the AC voltage.

公开(公告)号：US20180301403A1

公开(公告)日：2018-10-18

申请号：US15951003

申请日：2018-04-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeffrey MORRONI ,  Rajeev Dinkar JOSHI ,  Sreenivasan K. KODURI ,  Sujan Kundapur MANOHAR ,  Yogesh K. RAMADASS ,  Anindya PODDAR

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.

公开(公告)号：US20220415768A1

公开(公告)日：2022-12-29

申请号：US17898656

申请日：2022-08-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeffrey MORRONI ,  Rajeev Dinkar JOSHI ,  Sreenivasan K. KODURI ,  Sujan Kundapur MANOHAR ,  Yogesh K. RAMADASS ,  Anindya PODDAR

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.

公开(公告)号：US20180301404A1

公开(公告)日：2018-10-18

申请号：US15951021

申请日：2018-04-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeffrey MORRONI ,  Rajeev Dinkar JOSHI ,  Sreenivasan K. KODURI ,  Sujan Kundapur MANOHAR ,  Yogesh K. RAMADASS ,  Anindya PODDAR

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/29 ,  H01L23/31

Abstract: A semiconductor package includes a leadframe and a semiconductor die attached to the leadframe by way of solder posts. In a stacked arrangement, the package also includes a passive component disposed between the leadframe and the semiconductor die and electrically connected to the semiconductor die through the leadframe.

公开(公告)号：US20180301402A1

公开(公告)日：2018-10-18

申请号：US15950984

申请日：2018-04-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeffrey MORRONI ,  Rajeev Dinkar JOSHI ,  Sreenivasan K. KODURI ,  Sujan Kundapur MANOHAR ,  Yogesh K. RAMADASS ,  Anindya PODDAR

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in which at least a portion of the passive component is disposed in a stacked arrangement.