公开(公告)号：US20190013288A1

公开(公告)日：2019-01-10

申请号：US16028741

申请日：2018-07-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： WOOCHAN KIM ,  MASAMITSU MATSUURA ,  MUTSUMI MASUMOTO ,  KENGO AOYA ,  HAU THANH NGUYEN ,  VIVEK KISHORECHAND ARORA ,  ANINDYA PODDAR

IPC: H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L23/532 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/29 ,  H01L23/528

Abstract: An embedded die package includes a first die having an operating voltage between a first voltage potential and a second voltage potential that is less than the first voltage potential. A via, including a conductive material, is electrically connected to a bond pad on a surface of the first die, the via including at least one extension perpendicular to a plane along a length of the via. A redistribution layer (RDL) is electrically connected to the via, at an angle with respect to the via defining a space between the surface and a surface of the RDL. A build-up material is in the space.