公开(公告)号：US20220223488A1

公开(公告)日：2022-07-14

申请号：US17538820

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Marcus Rudolf ZIMNIK

IPC: H01L23/31 ,  H01L23/14 ,  G01L1/18

Abstract: An example semiconductor package includes a semiconductor die. In addition, the semiconductor package includes a mold compound having a first side, a second side opposite the first side, and an axis extending between the first side and the second side, the mold compound covering the semiconductor die. Further, the semiconductor package includes an interface member including a first portion and a second portion, the first portion is coupled to the second portion. The first portion is positioned along the first side, the second portion is positioned along the second side, and an engagement of a welding horn with the first portion is adapted to weld the second portion to a surface.