公开(公告)号：US20180204767A1

公开(公告)日：2018-07-19

申请号：US15658039

申请日：2017-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Helmut RINCK ,  Kai-Alexander SCHACHTSCHNEIDER ,  Fromund METZ ,  Mario SCHMIDPETER ,  Javier Gustavo MOREIRA

IPC: H01L21/768 ,  H01L21/285 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/76865 ,  H01L21/2855 ,  H01L21/31111 ,  H01L21/32139

Abstract: In accordance with at least one embodiment of the disclosure, a method of patterning platinum on a substrate is disclosed. In an embodiment, an adhesive layer is deposited over the substrate, a sacrificial layer is deposited over the adhesive layer, and a patterned photoresist layer is formed over the sacrificial layer. Then, the sacrificial layer is patterned utilizing the photoresist layer as a mask such that at least a portion of the adhesive layer is exposed. Subsequently, the top and sidewall surfaces of the patterned sacrificial layer and the first portion of the adhesive layer are covered by a platinum layer. Finally, the sacrificial layer and a portion of the platinum layer covering the top and sidewall surfaces of the sacrificial layer are etched, thereby leaving a remaining portion of the platinum layer to form a patterned platinum layer on the substrate.