公开(公告)号：US20230006635A1

公开(公告)日：2023-01-05

申请号：US17364214

申请日：2021-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Huiyao Chen ,  Ting-Ta Yen ,  Ricky A. Jackson ,  Martin Keegan

IPC: H03H9/02 ,  H03H9/17 ,  H03H3/02 ,  H03H3/08

Abstract: An integrated circuit (IC) resonator module for an IC package includes an acoustic resonator having a surface and a Bragg reflector adhered to the surface of the acoustic resonator. The Bragg reflector includes low impedance layers formed of a first material with a first acoustic impedance and a high impedance layer formed of a second material with a second acoustic impedance. The second acoustic impedance is greater than the first acoustic impedance. The Bragg reflector further includes a Bragg grating layer formed of randomly or periodically spaced patches of the second material separated by vias filled with the first material.