公开(公告)号：US20200321302A1

公开(公告)日：2020-10-08

申请号：US16843559

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/15 ,  H01L23/495 ,  H01L23/373

Abstract: In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.

公开(公告)号：US20200321267A1

公开(公告)日：2020-10-08

申请号：US16843618

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/495

Abstract: In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.

公开(公告)号：US20200319038A1

公开(公告)日：2020-10-08

申请号：US16843659

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK

IPC: G01L1/00 ,  G01L3/02 ,  C25D7/00

Abstract: In examples, a system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.

公开(公告)号：US20200321303A1

公开(公告)日：2020-10-08

申请号：US16843580

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L23/31

Abstract: In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.

公开(公告)号：US20220102307A1

公开(公告)日：2022-03-31

申请号：US17544888

申请日：2021-12-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

公开(公告)号：US20200321304A1

公开(公告)日：2020-10-08

申请号：US16843717

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.