公开(公告)号：US20240291696A1

公开(公告)日：2024-08-29

申请号：US18204260

申请日：2023-05-31

Applicant: Texas Instruments Incorporated

Inventor： Kumar Anurag Shrivastava ,  Sreeram S ,  Tarunvir Singh

IPC: H04L25/02 ,  H03K5/19 ,  H03K19/173 ,  H04B1/04 ,  H04B1/16

CPC classification number: H04L25/0266 ,  H03K5/19 ,  H03K19/173 ,  H04B1/04 ,  H04B1/16

Abstract: An example apparatus includes: transmitter channel circuitry including: a buffer having an output; and a capacitor having a first terminal and a second terminal, the first terminal of the capacitor coupled to the output of the buffer; an isolation transformer including: a first inductor having a terminal coupled to the second terminal of the capacitor; and a second inductor magnetically coupled to the first inductor across an isolation barrier, and receiver channel circuitry coupled to the second inductor.

公开(公告)号：US20240105382A1

公开(公告)日：2024-03-28

申请号：US17954735

申请日：2022-09-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kashyap BAROT ,  Sreeram S ,  Kumar Anurag SHRIVASTAVA ,  Viresh CHINCHANSURE

IPC: H01F27/30 ,  H01F27/32

CPC classification number: H01F27/303 ,  H01F27/306 ,  H01F27/324

Abstract: A transformer includes a substrate and a first metal layer having a first inductor having a first center tap. A second metal layer includes a second inductor having a second center tap, and the second metal layer includes a bond pad. A third metal layer includes a first conductor electrically connecting the bond pad to the first center tap, and the third metal layer includes a second conductor electrically connecting the bond pad and the first center tap. The third metal layer is situated between the substrate and the first metal layer, and the first metal layer is situated between the third metal layer and the second metal layer.