公开(公告)号：US20230101847A1

公开(公告)日：2023-03-30

申请号：US17491378

申请日：2021-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chittranjan Mohan GUPTA ,  Yiqi TANG ,  Rajen Manicon MURUGAN ,  Jie CHEN ,  Tianyi LUO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56

Abstract: In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.

公开(公告)号：US20200168533A1

公开(公告)日：2020-05-28

申请号：US16200278

申请日：2018-11-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jonathan Almeria NOQUIL ,  Osvaldo Jorge LOPEZ ,  Tianyi LUO

IPC: H01L23/495 ,  H01L23/40 ,  H01L23/373 ,  H01L25/065

Abstract: A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.