公开(公告)号：US20150364816A1

公开(公告)日：2015-12-17

申请号：US14740190

申请日：2015-06-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon MURUGAN ,  Minhong MI ,  Gary Paul MORRISON ,  Jie CHEN ,  Kenneth Robert RHYNER ,  Stanley Craig BEDDINGFIELD ,  Chittranjan Mohan GUPTA ,  Django Earl TROMBLEY

IPC: H01Q1/50 ,  H01L23/64 ,  H01P3/08 ,  H01L23/50 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract translation: 一种毫米波集成电路（IC）芯片。 IC芯片包括IC芯片和封装IC芯片的引线键合球栅阵列封装。 引线键合球栅阵列封装包括焊球阵列，毫米波发射通道和毫米波接收通道，其中每个毫米波发射和接收通道将IC管芯电耦合到焊球阵列的信号球，并且是 配置为在毫米波IC芯片的工作频带处谐振。

公开(公告)号：US20230101847A1

公开(公告)日：2023-03-30

申请号：US17491378

申请日：2021-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chittranjan Mohan GUPTA ,  Yiqi TANG ,  Rajen Manicon MURUGAN ,  Jie CHEN ,  Tianyi LUO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56

Abstract: In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.

公开(公告)号：US20230138570A1

公开(公告)日：2023-05-04

申请号：US17515295

申请日：2021-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas Dyer BONIFIELD ,  Sarvesh Jagdish BANG ,  Chittranjan Mohan GUPTA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065

Abstract: In examples, a semiconductor package comprises a first driver die adapted to be coupled to a high-side switch of a power supply, the first driver die adapted to drive a gate of the high-side switch. The package also includes a second driver die adapted to be coupled to a low-side switch of the power supply, the second driver die adapted to drive a gate of the low-side switch. The package also includes a controller die positioned between the first and second driver dies and configured to control the first and second driver dies. The package also includes a pair of bond wires configured to provide a differential signal between the controller die and the first driver die, a vertical plane of a bond wire in the pair of bond wires and a vertical plane of a side surface of the first driver die having an angle therebetween ranging from 80 to 95 degrees.

公开(公告)号：US20170229408A1

公开(公告)日：2017-08-10

申请号：US15497024

申请日：2017-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon MURUGAN ,  Minhong MI ,  Gary Paul MORRISON ,  Jie CHEN ,  Kenneth Robert RHYNER ,  Stanley Craig BEDDINGFIELD ,  Chittranjan Mohan GUPTA ,  Django Earl TROMBLEY

IPC: H01L23/66 ,  H01L23/00 ,  H01Q1/32 ,  H05K1/02 ,  H01Q1/22 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.