公开(公告)号：US12183672B2

公开(公告)日：2024-12-31

申请号：US17677729

申请日：2022-02-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ujwal Radhakrishna ,  Vinod Rai ,  Yogesh Ramadass ,  Anant Kamath ,  Kashyap Barot

IPC: H01L23/525 ,  H02H3/04

Abstract: A device includes first and second device terminals, a fuse, a first circuit, a first transistor, and a control circuit. The fuse terminal couples to the first device terminal. The first circuit couples to the second fuse terminal. The second fuse terminal has a first voltage. The first transistor has a first control input and first and second current terminals. The first current terminal couples to the second fuse terminal, and the second current terminal couples to the second device terminal. The control circuit: turns “on” the first transistor into a saturation region if the first voltage exceeds a threshold and a current through the fuse exceeds a trip threshold current of the fuse; and turns “on” the first transistor into a linear region if the first voltage exceeds a threshold and a current through the fuse is below the trip threshold current of the fuse.

公开(公告)号：US20230378023A1

公开(公告)日：2023-11-23

申请号：US17952111

申请日：2022-09-23

Applicant: Texas Instruments Incorporated

Inventor： Vinod Rai ,  Archana Venugopal ,  Blake Travis

IPC: H01L23/42 ,  H01L23/522 ,  H01L23/485 ,  H01L21/66

CPC classification number: H01L23/42 ,  H01L23/5228 ,  H01L23/485 ,  H01L22/12

Abstract: An electronic device includes a package structure, conductive leads partially exposed outside the package structure, and a semiconductor die having a semiconductor layer and a multilevel metallization structure, where the semiconductor die is enclosed by the package structure and the multilevel metallization structure includes a heater resistor, a sense resistor, and conductive metal features electrically coupled to respective terminals of the heater resistor and the sense resistor, with the conductive metal features electrically coupled to respective ones of the conductive leads.