公开(公告)号：US20230253277A1

公开(公告)日：2023-08-10

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/14

CPC classification number: H01L23/31 ,  H01L25/0655 ,  H01L21/565 ,  H01L23/564 ,  H01L23/293 ,  H01L23/142

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20220181224A1

公开(公告)日：2022-06-09

申请号：US17116963

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/14 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.