公开(公告)号：US20220068744A1

公开(公告)日：2022-03-03

申请号：US17003382

申请日：2020-08-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Todd WYANT ,  Matthew John SHERBIN ,  Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  You Chye HOW

IPC: H01L23/31 ,  H01L21/78 ,  H01L23/552 ,  H01L21/56 ,  H01L21/683

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.