公开(公告)号：US20220059423A1

公开(公告)日：2022-02-24

申请号：US17001429

申请日：2020-08-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  Qiao CHEN

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

公开(公告)号：US20220068744A1

公开(公告)日：2022-03-03

申请号：US17003382

申请日：2020-08-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Todd WYANT ,  Matthew John SHERBIN ,  Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  You Chye HOW

IPC: H01L23/31 ,  H01L21/78 ,  H01L23/552 ,  H01L21/56 ,  H01L21/683

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.

公开(公告)号：US20240234231A1

公开(公告)日：2024-07-11

申请号：US18617517

申请日：2024-03-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  Qiao CHEN

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/315 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/07025 ,  H01L2924/19104

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

公开(公告)号：US20230065075A1

公开(公告)日：2023-03-02

申请号：US17463047

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Qiao CHEN ,  Vivek Swaminathan SRIDHARAN ,  Christopher Daniel MANACK ,  Patrick Francis THOMPSON ,  Jonathan Andrew MONTOYA ,  Salvatore Frank PAVONE

IPC: H01L23/00

Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.

公开(公告)号：US20210193600A1

公开(公告)日：2021-06-24

申请号：US16721546

申请日：2019-12-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vivek Swaminathan SRIDHARAN ,  Christopher Daniel MANACK ,  Nazila DADVAND ,  Salvatore Frank PAVONE ,  Patrick Francis THOMPSON

IPC: H01L23/00

Abstract: In some examples, a package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer.