公开(公告)号：US20140167795A1

公开(公告)日：2014-06-19

申请号：US13714740

申请日：2012-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATION

Inventor： Joseph S. Mayfield ,  Chad R. Turner ,  Nolan B. Riley

IPC: G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2867

Abstract: Fault analysis of high power integrated circuits face thermal management challenges. This invention employs thermal diodes incorporated in the device undergoing fault analysis, and a closed loop microprocessor controlled feedback system for thermal control during test and fault analysis.

Abstract translation: 大功率集成电路故障分析面临热管理挑战。 本发明采用结合在经历故障分析的装置中的热二极管，以及用于在测试和故障分析期间进行热控制的闭环微处理器控制的反馈系统。