Abstract:
A gate control circuit for a tristate output buffer operating in a first voltage domain includes a pull-up circuit coupled between an upper rail and a first gate control signal, a pull-down circuit coupled between a lower rail and a second gate control signal, and a gate isolation switch coupled between the first gate control signal and the second gate control signal. The gate isolation switch includes a first PMOS transistor coupled in parallel with a first NMOS transistor. The first NMOS transistor is controlled by a first enable signal and the first PMOS transistor is controlled by a second enable signal.
Abstract:
An apparatus, comprising: a PMOS current mirror have a first PFET and a second PFET coupled at their respective gates; a first current source coupled to drain of the first PFET; a second current source configured to have a current that is greater than the first current source, coupled to the drain of the second PFET; a capacitor coupled to the gates of the PFET current mirror; a third PFET gate-coupled to the current mirror; a driver NFET having a gate coupled to the drain of the third PFET, wherein a drain of the driver NFET is coupled to the capacitor.
Abstract:
A wireless transmitter (TX1). The transmitter comprises circuitry for providing a plurality of control (CONTROL) bits and circuitry for providing a plurality of user (USER) bits. The transmitter also comprises circuitry for modulating (16) the plurality of control bits and the plurality of user bits into a stream of complex symbols and circuitry (18) for converting the stream of complex symbols into a parallel plurality of complex symbol streams. The transmitter also comprises circuitry (20) for performing an inverse fast Fourier transform on the parallel plurality of complex symbol streams to form a parallel plurality of OFDM symbols and circuitry (22) for converting the parallel plurality of OFDM symbols into a serial stream of OFDM symbols. Each OFDM symbol in the serial stream of OFDM symbols comprises a plurality of data points, and selected (SF2.x) OFDM symbols in the serial stream of OFDM symbols carry modulation information (AMOD). The modulation information in one or more of the selected OFDM symbols comprises a plurality of modulation groups, and the plurality of modulation groups comprises a number of modulation parameters that describe modulation of a corresponding set of data points in a subsequent OFDM symbol in the serial stream of OFDM symbols.
Abstract:
Methods and apparatus for quantum point contacts. In an arrangement, a quantum point contact device includes at least one well region in a portion of a semiconductor substrate and doped to a first conductivity type; a gate structure disposed on a surface of the semiconductor substrate; the gate structure further comprising a quantum point contact formed in a constricted area, the constricted area having a width and a length arranged so that a maximum dimension is less than a predetermined distance equal to about 35 nanometers; a drain/source region in the well region doped to a second conductivity type opposite the first conductivity type; a source/drain region in the well region doped to the second conductivity type; a first and second lightly doped drain region in the at least one well region. Additional methods and apparatus are disclosed.
Abstract:
A system includes a non-programmable bus master. The non-programmable bus master includes a memory protection unit (MPU) to operate in a first configuration with a first set of access permissions and a second configuration with a second set of access permissions, and hardware logic. The hardware logic executes a first task and a second task. The tasks generate transactions and the hardware logic switches between executing the first and second tasks. The hardware logic also causes the MPU to operate in the first configuration when the hardware logic executes the first task and causes the MPU to operate in the second configuration when the hardware logic executes the second task.
Abstract:
Fault analysis of high power integrated circuits face thermal management challenges. This invention employs thermal diodes incorporated in the device undergoing fault analysis, and a closed loop microprocessor controlled feedback system for thermal control during test and fault analysis.