RADIATION DETECTOR AND ASSOCIATED MANUFACTURING METHOD

    公开(公告)号:US20230016835A1

    公开(公告)日:2023-01-19

    申请号:US17787328

    申请日:2020-12-17

    摘要: A radiation detector includes a stack of layers along a direction Z, the stack comprising: an absorbent layer, a first contact layer, an assembly consisting of at least one intermediate layer, referred to as an intermediate assembly, an upper layer, the first contact layer and the upper layer having a plurality of detection zones and separation zones, a detection zone corresponding to a pixel of the detector, a passivation layer made from a dielectric material, arranged on the upper layer and having openings at the level of the detection zones of the upper layer, the semiconductor layers of the stack being compounds based on elements of groups IIIA and VA of the periodic table of the elements, the second material comprising the VA element antimony and the third material not comprising the VA element antimony.

    METHOD FOR MANUFACTURING A PHOTOSENSOR COMPRISING A STACK OF LAYERS PLACED ON TOP OF EACH OTHER

    公开(公告)号:US20190157338A1

    公开(公告)日:2019-05-23

    申请号:US16316010

    申请日:2017-07-06

    IPC分类号: H01L27/146

    摘要: The invention relates to a method for manufacturing a photodetector able to operate for the photodetection of infrared electromagnetic waves, comprising a stack of thin layers placed on top of one another. The method includes obtaining a first assembly (E1) of stacked layers, forming a detection assembly, comprising a first substrate layer, a photoabsorbent layer, a barrier layer and at least one contact layer, and a second assembly (E2) of stacked layers forming a reading circuit, comprising at least one second substrate layer and a multiplexing layer. The first and second assemblies are glued between the contact layer of the first assembly and the multiplexing layer of the second assembly. Etching through the second assembly makes it possible to obtain a plurality of interconnect vias, then p or n doping of zones of the first contact layer of the first assembly through the interconnect, vias.

    RADIATION DETECTOR AND ASSOCIATED IMAGER
    6.
    发明申请

    公开(公告)号:US20200044110A1

    公开(公告)日:2020-02-06

    申请号:US16316020

    申请日:2017-07-07

    IPC分类号: H01L31/109 H01L31/0352

    摘要: The invention relates to a radiation detector comprising a stack of superimposed layers successively comprising: an absorbent layer configured to absorb the radiation and made from a first semiconductor material, a screen charges layer made from a semiconductor material having a second bandgap value, a transition layer made from a semiconductor material having a third bandgap value, and a transition layer made from a semiconductor material having a third bandgap value, the absorbent layer and the screen charges layer having a doping of a first type, the first window layer having a doping of a second type, a dopant density of the window layer being greater than the dopant density of the transition layer.