公开(公告)号：US20240042107A1

公开(公告)日：2024-02-08

申请号：US18486236

申请日：2023-10-13

Applicant: THE TEXAS A&M UNIVERSITY SYSTEM

Inventor： Duncan J. Maitland ,  Adam M. Orendain

IPC: A61L31/06 ,  A61L31/14 ,  A61F2/07 ,  A61B17/12

CPC classification number: A61L31/06 ,  A61L31/146 ,  A61F2/07 ,  A61B17/12181 ,  A61B17/12118 ,  A61B17/12113 ,  A61L31/148 ,  A61L31/18

Abstract: An embodiment includes an apparatus comprising: a shape memory polymer (SMP) foam having an outside surface; and a membrane that encapsulates at least 50% of the outside surface of the SMP foam; wherein (a) the SMP foam includes a thermoset SMP, and (b) the membrane includes a thermoplastic polymer. Other embodiments are addressed herein.

公开(公告)号：US11786641B2

公开(公告)日：2023-10-17

申请号：US16652588

申请日：2018-10-10

Applicant: THE TEXAS A&M UNIVERSITY SYSTEM

Inventor： Duncan J. Maitland ,  Adam M. Orendain

IPC: A61L31/14 ,  A61L31/06 ,  A61F2/07 ,  A61B17/12 ,  A61L31/18

CPC classification number: A61L31/06 ,  A61B17/12113 ,  A61B17/12118 ,  A61B17/12181 ,  A61F2/07 ,  A61L31/146 ,  A61L31/148 ,  A61L31/18 ,  A61L2300/606 ,  A61L2400/16 ,  A61L2430/36

Abstract: An embodiment includes an apparatus comprising: a shape memory polymer (SMP) foam having an outside surface; and a membrane that encapsulates at least 50% of the outside surface of the SMP foam; wherein (a) the SMP foam includes a thermoset SMP, and (b) the membrane includes a thermoplastic polymer. Other embodiments are addressed herein.

公开(公告)号：US20200230298A1

公开(公告)日：2020-07-23

申请号：US16652588

申请日：2018-10-10

Applicant: THE TEXAS A&M UNIVERSITY SYSTEM

Inventor： Duncan J. Maitland ,  Adam M. Orendain

IPC: A61L31/06 ,  A61L31/14

Abstract: An embodiment includes an apparatus comprising: a shape memory polymer (SMP) foam having an outside surface; and a membrane that encapsulates at least 50% of the outside surface of the SMP foam; wherein (a) the SMP foam includes a thermoset SMP, and (b) the membrane includes a thermoplastic polymer. Other embodiments are addressed herein.